Jedec Standards презентация

JEDEC Introduction
JEDEC was founded in 1960 and stands for the Joint Electron Device Engineering Council.
JEDEC is the standardization body of the Electronic Industries Alliance, which helps develop standards on electronic components, consumer electronics, electronic information, telecommunications, and internet security.
JEDEC issues often used standards for device interfaces, such as RAM and DDR SDRAM(double-data-rate synchronous dynamic random access memory), which is a type of memory in integrated circuits used in computers.
Wikipedia,http://en.wikipedia.org/wiki/JEDEC

JEDEC Introduction
JEDEC Philosophy:JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products.
JEDEC has 2700 participants, appointed by 270 companies work in 50 committees. The world community accepts the publications and standards that they generate.
Jedec, http://www.jedec.org/

Examples of standards
JESD 22-A103C HIGH TEMPERATURE STORAGE LIFE: The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state devices.
High Temperature storage test is typically used to determine the effect of time and temperature, under storage conditions, for thermally activated failure mechanisms of solid state electronic devices
During the test elevated temperatures (accelerated test conditions) are used without electrical stress applied.

Examples of standards
JESD 22-A104C TEMPERATURE CYCLING: This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling.
JESD 22-A106B
THERMAL SHOCK: This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.

JESD 51 Methodology for the Thermal Measurement of Component Packages
JESD51-1 Integrated Circuit Thermal Measurement Method – Electrical Test Method
JESD51-2 Integrated Circuit Thermal Test Method Environmental Conditions – Natural Convection
JESD51-3 Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-4 Thermal Test Chip Guideline
JESD51-5 Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms
JESD51-6 Integrated Circuit Thermal Test Method Environmental Conditions – Forced Convection
JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD 51 cont.
JESD51-8 Integrated Circuit Thermal Test Method Environmental Conditions – Junction to Board
JESD51-9 Test Boards for Area Array Surface Mount Package Thermal Measurements
JESD51-10 Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
JESD51-11 Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements
JESD51-12 Guidelines for Reporting and Using Electronic Package Thermal Information

JESD 22-A103C High Temperature Storage Life
Scope: Determine the effect of time and temperature, under storage conditions, of thermally activated failure mechanisms of solid state electronic devices.
Jedec Standard,http://www.jedec.org/download/search/22a103c.pdf

Apparatus of Test
The apparatus is a temperature controlled chamber capable of maintaining the entire sample population at a specified testing temperature.

Method of Testing
The samples will be stored at one of the temperature conditions given in Table 1:
Table 1: High Temperature Storage Conditions

Method of Testing
Typically, the sample is tested under condition B for 1000 hours, but other conditions or durations may be used.
Note: the rate of temperature increase should be low to prevent overstress of the sample that would not occur under normal conditions.
The failure criteria for a sample is:
The part can no longer function as designed
Cracking, chipping, or breaking of the package as long as the package performance was critical to the performance of the sample. However, if the damage was due to fixtures or handling, then failure is not attributed to the test.

Method of Testing
Things to be specified:
Sample size and number of failures
Time and conditions
Whether intermediate measurements were taken

JESD51-12 Guidelines for Reporting and Using Electronic Package Thermal Information
θJA junction-to-still ambient air resistance (natural convection
θJMA junction-to-moving air resistance (forced convection)

Deviations During Application
Results during application may vary since the application may differ from the following test conditions:
Power dissipation
Air velocity, direction, turbulence
Power and number of adjacent components and boards
PCB orientation and size
Two-sided vs. one-sided mounting
Die size
Copper trace thickness and widths
Environment (for example, natural convection tests are done in a chamber 1 ft3)

Conduction resistances
θjctop, θjcbot – junction to top of case and bottom of case resistances, respectively
θjb – junction to board resistances
Leaded package: measure Tboard to foot of lead
Surface mount package: measure board trace within 1 mm of package
These resistances are found by forcing all of the heat flow to go out the respective surface, which may not match reality

Thermal Characterization Parameter
ΨJT – junction to top thermal characterization
ΨJB – junction to board thermal characterization
The equations are the same as those for thermal resistance q except that the power P is now the total power, not just the power in that direction. For example, if only 5% of your total heat loss is down through the PCB, your P would still be your total power.
These can help with estimates of junction temperature for object already under use where temperatures can be measured and there is no heat sink present (instead of for the design phase)

Compact Models
Two-resistor model: good for hand calculations but not really accurate

DELPHI Compact Models
These are mathematical models, not thermal resistance model
Provided by some component manufacturers

Effect of Package Construction on Thermal Results
2s0p: two signal planes, zero power planes on laminate substrate for plastic ball grid array packages
Added copper improves performance

Effect of PCB Design
More copper to spread heat means better performance.

Effect of Multiple Packages

Effect of PCB size
On setups where a lot of heat is carried away by the copper in the PCB, the larger the PCB the better the performance – more heat transfer area.

Effect of Die Size
For the same power, larger dies have a smaller heat flux and hence better performance. Smaller dies tend to be cheaper, though.
a) PBGA package (plastic) b) ceramic flip chip

Effect of Die Power Level
As power levels go up, so do surface temperatures. This increases natural convection and radiation, decreasing θJA

Reporting Requirement Examples

Reporting Requirement Examples